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Heat Sink Compounds

Viscous fluid which increases the thermal conductivity of a thermal interface by filling microscopic air-gaps present due to the imperfectly flat and smooth surfaces of the components. In electronics, it is often used to aid a component's thermal dissipation via a heat sink.

  1. Antec Formula 6 heat sink compound 5.3 W/m·K 4 g

    47 Available

    Ex.Vat: €7.33 Inc.Vat: €9.02

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